Laser Slicing to Slash SiC Wafer Costs, Boost Yield

Japanese ingot processing equipment manufacturer DISCO Corporation has unveiled a new laser-based technique to slice wafers out of a SiC ingot, producing 50% more wafers through reduced material losses while slashing production times by a factor of six.

from EETimes: http://www.eetimes.com/document.asp?doc_id=1330333&_mc=RSS_EET_EDT